Faculty Directory
Carolyn Duran

Adjunct Professor of Materials Science and Engineering

Senior Director, Product Integrity at Apple

2022 Materials Research Society President

Contact

2220 Campus Drive
Cook Hall, Room 2036
Evanston, IL 60208-3109

Email Carolyn Duran

Departments

Materials Science and Engineering

Download CV

Education

Ph.D., Materials Science and Engineering, Northwestern University

B.S., Materials Science and Engineering, Carnegie Mellon University


Biography

Prior to joining Apple in 2023, Carolyn spent 25 years at Intel Corporation holding leadership positions across the corporation including technology development, memory and IO technologies, and supply chain.  Within those roles, Carolyn led advanced process and materials research; drove pathfinding, architecture, validation and standards development for DRAM memory and high-speed IO; and oversaw Intel’s supply chain sustainability efforts, including chemical regulations and policy, human rights, labor and ethics practices, and the company’s responsible minerals sourcing program.


Significant Recognition

  • Fast Company's "Most Creative People in Business 1000" (2016)
  • Ranked #2 in Business Insider's "Most Powerful Women Engineers in the World" (2014)
  • Intel Achievement Award (2014)
  • National Science Foundation Fellowship (1994)

Significant Professional Service

  • External Advisory Board, The Ohio State University Center for Emergent Materials, NSF MRSEC, 2023-present
  • Materials Research Society President, 2022
  • Board of Directors, Responsible Business Alliance (2016-2017, Chair in 2017)
  • Steering Committee Chair, Responsible Minerals Initiative (2015-2016)
  • Northwestern University Materials Science and Engineering Academic Advisory Board (2008-present)
  • University of California Berkeley Materials Science and Engineering Advisory Board (2003-present)

Patents

  1. Diana, D.C., Duran, C.R., Lindstedt, R.C., Silberstein, M.E. 2008 Ferroelectric polymer memory structure and method therefor, US Patent Number 7344897
  2. Miaz, J.A., Morrow, X., Marieb, T., Block, C. (née Duran), Leu, J., McGregor, P., Kuhn, M., Taylor, M. 2004 Surface alteration of metal interconnect in integrated circuits for electromigration and adhesion improvement, US Patent Number 6794755
  3. Marieb, T.N., McGregor, P., Block, C. (née Duran), Jin, S. 2007 Copper alloys for interconnections having improved electromigration characteristics and methods of making same, US Patent Number 7220674
  4. Marieb, T.N., McGregor, P., Block, C. (née Duran), Jin, S. 2005 Copper alloys for interconnections having improved electromigration characteristics and methods of making same, US Patent Number 6977220
  5. Marieb, T.N., McGregor, P., Block, C. (née Duran), Jin, S. 2004 Copper alloys for interconnections having improved electromigration characteristics and methods of making same, US Patent Number 6800554